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Album Download | Free Album Download | Free Album Download, Mp3 | Mp3 Hosting (Free Mp3 Hosting)The present invention relates to a method of and an apparatus for manufacturing a semiconductor integrated circuit device, and more particularly to a method of and an apparatus for inspecting a wafer (semiconductor substrate) which can be performed while the temperature of the wafer is being maintained at a constant level.
In the manufacture of a semiconductor integrated circuit device, a wafer is subjected to various processes such as deposition of a film, exposure of a resist, etching of an insulating film, heat treatment and ion injection. Various detecting means are generally employed for detecting the progress of the manufacturing of a semiconductor integrated circuit device in association with the various processes.
In the present invention, the wafer is a semiconductor substrate in which a semiconductor integrated circuit device is formed. The processes performed for the wafer is inclusive of processes of forming a circuit pattern in a semiconductor substrate, processes for forming an interconnecting pattern after the formation of the circuit pattern, processes for forming an insulating film on the substrate having the circuit pattern and the interconnecting pattern, and processes for forming a film which is to be a device film such as an electrode film, a barrier metal film or an insulating film. The process steps are performed on a plurality of wafer substrates.
The inspection of a semiconductor integrated circuit device is generally performed in such a manner that the wafer is selectively exposed to an inspection radiation and the same is detected to determine whether the wafer is defective.
Heretofore, if the wafer is the one, which is transferred from one of various manufacturing lines to the other manufacturing line, the wafer must be transferred by a robot hand which is different from the robot hand for the wafer in the manufacturing line to which the wafer is transferred. However

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